SEED PANEL
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United States of America Patent
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Issued Date -
Feb 16, 2012
app pub date -
Aug 10, 2011
filing date -
Aug 11, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The present disclosure provides a composite article including at least one seed for planting and a method of forming the composite article. The composite article includes a substrate element and a cover element spaced from the substrate element. An adhesive layer is disposed between the substrate element and the cover element for coupling the substrate element and the cover element to one another. The composite article further includes at least one seed abutting the adhesive layer and disposed between the substrate element and the cover element. The cover element is configured to be separated from the adhesive layer for exposing at least a portion of the seed. The present disclosure also provides a method of forming the composite article and a method of planting the seed.
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