METHOD OF MANUFACTURING SEMICONDUCTOR LASER DEVICE, SEMICONDUCTOR LASER DEVICE AND LIGHT APPARATUS

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United States of America Patent

SERIAL NO

13274710

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Abstract

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A method of manufacturing a semiconductor laser device comprises steps of forming a first semiconductor laser device substrate having first grooves for cleavage on a surface thereof, bonding a second semiconductor laser device substrate onto the surface side having the first grooves and thereafter cleaving the first and second semiconductor laser device substrates along at least the first grooves.

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Patent Owner(s)

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SANYO ELECTRIC CO LTDMORIGUCHI-SHI OSAKA 570

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BESSHO, Yasuyuki Moriguchi-shi, JP 51 509
HATA, Masayuki Moriguchi-shi, JP 181 2589
KUNOH, Yasumitsu Moriguchi-shi, JP 21 286
OHBO, Hiroki Moriguchi-shi, JP 25 259
TAKEUCHI, Kunio Moriguchi-shi, JP 45 736
TOKUNAGA, Seiichi Moriguchi-shi, JP 16 577

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