Package structure with underfilling material and packaging method thereof
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United States of America Patent
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N/A
Issued Date -
Feb 9, 2012
app pub date -
Sep 23, 2010
filing date -
Aug 4, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method for packaging semiconductor device is provided, which comprises: providing a carrier substrate having a top surface and a back surface, a circuit arrangement on the top surface of the carrier substrate, and a through hole is disposed near the center of the carrier substrate and is formed passed through the carrier substrate; providing a chip having an active surface and a back surface, a plurality of pads is disposed on the periphery of the active surface and a plurality of connecting elements is disposed thereon; the active surface of chip is flipped and bonded on the circuit arrangement on the top surface of the carrier substrate, and the plurality of connecting elements is not covering the through hole; filling the underfilling material to encapsulate between the plurality of connecting elements and the top surface of the carrier substrate and to fill with the through hole; and performing a suction process to remove the air within the underfilling material between the plurality of connecting elements on the chip and the top surface of the carrier substrate, such that the underfilling material can completely encapsulate between the plurality of connecting elements on the chip and the top surface of the carrier surface.
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