SEMICONDUCTOR DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20120032301A1
SERIAL NO

13198374

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A semiconductor device includes a lead frame including an island, a power supply lead, and a GND lead; a sheet-like solid electrolytic capacitor that is mounted on the island; a semiconductor chip that is mounted on the solid electrolytic capacitor, a plane area of the semiconductor chip being smaller than that of the solid electrolytic capacitor; a bonding wire that connects the semiconductor chip and the solid electrolytic capacitor, and a bonding wire that connects the solid electrolytic capacitor and the power supply lead or the GND lead, in which at least the connection part between the anode plate and the anode part of the solid electrolytic capacitor and the connection part between the anode plate and the bonding wire do not overlap when being vertically projected.

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Patent Owner(s)

Patent OwnerAddress
NEC TOKIN CORPORATION7-1 KORIYAMA 6-CHOME TAIHAKU-KU SENDAI-SHI MIYAGI

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KASUGA, Takeo Sendai-shi, JP 11 61
SAITO, Takeshi Sendai-shi, JP 413 6864
SAKATA, Koji Sendai-shi, JP 76 1400

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