MICROCRYSTALLINE-TO-AMORPHOUS GOLD ALLOY AND PLATED FILM, AND PLATING SOLUTION FOR THOSE, AND PLATED FILM FORMATION METHOD
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United States of America Patent
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Issued Date -
Feb 9, 2012
app pub date -
Feb 17, 2010
filing date -
Feb 17, 2009
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Abandoned
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Abstract
Disclosed is a microcrystalline-to-amorphous gold alloy-plated film having excellent electrical properties and excellent mechanical properties. Physical properties including both the advantageous properties of a crystalline structure and the advantageous properties of an amorphous structure can be obtained by allowing a microcrystalline phase and an amorphous phase to exist in a mixed state at a specific ratio. The average particle diameter of the microcrystals is 30 nm or smaller, the volume fraction of the microcrystals is 10 to 90%, the knoop hardness is Hk 180 or more, the specific resistivity is 200 μΩ-cm or less. In the film, hardness and abrasion resistance can be improved while maintaining a good specific resistivity value and chemical stability both inherent to gold at practically insignificant levels. Therefore, the film is useful as a material for connecting an electric or electronic component such as a connector and a relay.
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