Grinding Tool For Trapezoid Grinding Of A Wafer

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United States of America Patent

APP PUB NO 20120028555A1
SERIAL NO

12847015

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Abstract

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A grinding tool for trapezoid grinding of a wafer on a profiling machine includes an annular wheel including a central hole adapted for mounting the wheel on a spindle. The wheel includes at least two grooves disposed at an outer edge of the wheel and the grooves are sized for receiving an outer edge of the wafer. At least one of the grooves is adapted for rough grinding of the wafer. At least one other of the grooves is adapted for fine grinding of the wafer.

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Patent Owner(s)

Patent OwnerAddress
MEMC ELECTRONIC MATERIALS INC501 PEARL DRIVE ST PETERS MO 63376

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Albrecht, Peter D O'Fallon, US 23 401
Vandamme, Roland Wentzville, US 10 62
Zhang, Guoqiang David Ballwin, US 8 50

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