Radiation-Curable Adhesive Composition for Optical Component and Adhesive Optical Component

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United States of America Patent

APP PUB NO 20120028041A1
SERIAL NO

13201592

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided is a radiation-curable adhesive composition for an optical component, the radiation-curable adhesive composition exhibiting a high tensile strength and flexibility suitable for enabling stable adhesion between the optical component and an adherend when light-cured and exhibiting excellent durability. A radiation-curable adhesive composition for an optical component includes 100 parts by weight of a specific (meth)acrylic copolymer (A), 2 to 20 parts by weight of a specific radiation-curable acrylic compound (B), 3 to 50 parts by weight of a specific radiation-curable acrylic compound (C), 0.1 to 10 parts by weight of a hydrogen abstraction-type photopolymerization initiator (D), 0.01 to 10 parts by weight of an isocyanate crosslinking agent (E), and 0.01 to 3 parts by weight of a silane compound (F), wherein the total amount of the amount of (B) mixed and the amount of (C) mixed is 5 to 60 parts by weight.

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Patent Owner(s)

Patent OwnerAddress
SOKEN CHEMICAL & ENGINEERING CO LTD29-5 TAKADA 3-CHOME TOSHIMA-KU TOKYO 1718531 ?1718531

International Classification(s)

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  • 2010 Application Filing Year
  • C09J Class
  • 414 Applications Filed
  • 222 Patents Issued To-Date
  • 53.63 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances201020112012201320142015201620172018201920200255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
An, Mingxing Sayama-shi, JP 2 4
Koyama, Yuji Sayama-shi, JP 53 148

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  • 2 Citation Count
  • C09J Class
  • 5.65 % this patent is cited more than
  • 13 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges7792291221101 - 1011 - 2021 - 3031 - 4041 - 5061 - 7071 - 8081 - 900510152025303540455055606570758085

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