Methods to recover and purify silicon particles from saw kerf
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United States of America Patent
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Sep 10, 2013
Grant Date -
Feb 2, 2012
app pub date -
Oct 13, 2011
filing date -
Dec 31, 2008
priority date (Note) -
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Abstract
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
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