ELECTRONICS SUBSTRATE WITH ENHANCED DIRECT BONDED METAL
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United States of America Patent
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app pub date -
Jul 26, 2011
filing date -
Jul 28, 2010
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Abstract
A substrate for electronic components includes a ceramic tile and a cooling metal layer. The cooling metal layer can include copper, aluminum, nickel, gold, or other metals. The cooling metal layer has an enhanced surface facing away from the ceramic tile, where the enhanced surface includes either fins or pins. Electronic components can be connected to the substrate on a surface opposite the cooling metal layer.
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