Reticle Cooling in a Lithographic Apparatus

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United States of America Patent

APP PUB NO 20120026474A1
SERIAL NO

13097781

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Abstract

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An apparatus and method reduce temperature variation across a reticle so as to reduce the expansion variation of the reticle. One method for realizing reduced temperature variation is to fill an inner space with backfill gas under pressure, using distribution trenches and walls (e.g., flow restriction dams), rather than providing uniform backfill gas pressure across the entire reticle. In another method, the perimeter of inner space can be chosen to reduce the expansion variation across the reticle based on the functional relationship between expansion and temperature for the reticle material. In an optional or alternative approach, reduced temperature variation across the reticle can be obtained by selectively filling cavities in the interior of the fluid cooled chuck with backfill gas.

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Patent Owner(s)

Patent OwnerAddress
ASML HOLDING N VHOLLAND WEIDE EINDHOVEN VELDHOVEN NORTH BRABANT

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NAYFEH, Samir A Shrewsbury, US 24 143

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