BALL GRID ARRAY PACKAGE
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United States of America Patent
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Issued Date -
Feb 2, 2012
app pub date -
Nov 1, 2010
filing date -
Jul 30, 2010
priority date (Note) -
Abandoned
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Abstract
A BGA package includes an IC die, a substrate, a plurality of solder balls, and a square contact pad. The portions of the contact pad capable of interfering with the IC die are removed to ensure the space between two of the contact pads is sufficient to avoid noise interference.
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