Semiconductor device
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United States of America Patent
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Jun 16, 2015
Grant Date -
Feb 2, 2012
app pub date -
Mar 30, 2011
filing date -
Jul 28, 2010
priority date (Note) -
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Abstract
A semiconductor device which includes a substrate, a semiconductor element arranged on the substrate, a heat dissipation component arranged on the semiconductor element, and a mold component covering an upper part of the substrate, the semiconductor element and the heat dissipation component, wherein an area of a surface on the semiconductor element of the heat dissipation component is larger than an area of a surface on which the heat dissipation component of the semiconductor element is arranged.
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