Methods to slice a silicon ingot
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United States of America Patent
Stats
-
Aug 13, 2013
Grant Date -
Feb 2, 2012
app pub date -
Oct 13, 2011
filing date -
Dec 31, 2008
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
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International Classification(s)
- 2011 Application Filing Year
- B07C Class
- 103 Applications Filed
- 78 Patents Issued To-Date
- 75.73 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- B07C Class
- 0 % this patent is cited more than
- 12 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 13, 2025 |
