SOLAR PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
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United States of America Patent
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Issued Date -
Feb 2, 2012
app pub date -
Jul 27, 2010
filing date -
Jul 27, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention provides a solar package structure and a method for fabricating the same. A solar package structure includes a carrier wafer. A conductive pattern layer is disposed on the carrier wafer. A solar cell chip array is disposed on the conductive pattern layer, wherein the solar cell chip array electrically connects to the conductive pattern layer. A first spacer dam is disposed on the carrier wafer, surrounding the solar cell chip array. A first optical element array is disposed over the carrier wafer to concentrate sunbeams onto the solar cell chip array, wherein the first optical element array is spaced apart from the carrier wafer by the first spacer dam.
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