RESIN COMPOSITION FOR LASER ENGRAVING, RELIEF PRINTING PLATE PRECURSOR FOR LASER ENGRAVING AND PROCESS FOR PRODUCING THE SAME, AND RELIEF PRINTING PLATE AND PROCESS FOR MAKING THE SAME

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United States of America Patent

APP PUB NO 20120024224A1
SERIAL NO

13185815

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Abstract

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A resin composition for laser engraving, comprising (Component A) a compound having two or more ring structures selected from the group consisting of an epoxy ring, an oxetane ring and a five-membered carbonate ring, (Component B) a curing agent capable of reacting with Component A to thus form a crosslinked structure, and (Component C) a compound having at least one of a hydrolyzable silyl group and a silanol group.

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Patent Owner(s)

Patent OwnerAddress
FUJIFILM CORPORATION26-30 NISHIAZABU 2-CHOME MINATO-KU TOKYO 106-8620

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANCHIKU, Shigefumi Haibara-gun, JP 14 26
SUGASAKI, Atsushi Haibara-gun, JP 57 185

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