SURFACE-MOUNTED SHIELDED MULTICOMPONENT ASSEMBLY
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United States of America Patent
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app pub date -
Jun 17, 2011
filing date -
Dec 19, 2008
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Abstract
A surface-mounted shielded multicomponent assembly, comprising a wafer on which several electronic components are assembled; an insulating layer conformally deposited on the structure with a thickness smaller than the height of the electronic components, comprising at least one opening emerging on a contact of said wafer; a conductive shielding layer covering the insulating layer and said at least one opening; and a resin layer covering the conductive layer.
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