RESIN SUPPLY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
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United States of America Patent
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Issued Date -
Jan 26, 2012
app pub date -
Jul 12, 2011
filing date -
Jul 26, 2010
priority date (Note) -
Abandoned
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Abstract
According to one embodiment, a resin supply device is configured to supply granular resins to a resin mold device including a first mold provided with a cavity and a second mold mated to the first mold. The resin supply device includes a first mechanism and a second mechanism. The first mechanism is configured to juxtapose multiple granular resins on an adsorption surface by adsorbing the multiple granular resins on the adsorption surface larger than the granular resins, and form an adsorbed resin body with a uniform thickness. The adsorbed resin body is made of the adsorbed multiple granular resins on the adsorption surface. The second mechanism is configured to drop the multiple granular resins adsorbed on the adsorption surface into the cavity by adsorption-release of the adsorption surface.
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