MICRO FORCE SENSOR PACKAGE FOR SUB-MILLINEWTON ELECTROMECHANICAL MEASUREMENTS
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United States of America Patent
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Issued Date -
Jan 26, 2012
app pub date -
Jan 4, 2010
filing date -
Mar 31, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A force sensor package includes the following main parts: a MEMS force sensor, an interface circuit converting a change of capacitance into an analog or digital sensor output signal, and a substrate on which the MEMS force sensor and the IC are attached. The interface circuit is a die in order to minimize the size of the force sensor. The MEMS force sensor and the interface circuit are attached to the substrate by an adhesive, e.g. glue. Electrical contacts are then realized by wire-bonding. Alternatively, the two parts may also be attached to the substrate by a flip-chip process using solder. A protective cover may be placed over the assembly.
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