PLASMA DOPING APPARATUS AND PLASMA DOPING METHOD

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United States of America Patent

APP PUB NO 20120015507A1
SERIAL NO

13183938

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A plasma doping apparatus for adding an impurity to a semiconductor substrate includes a chamber, a gas supply unit configured for supplying gas to the chamber, and a plasma source by which to cause the chamber to generate plasma of the supplied gas. The mixed gas containing material gas containing an impurity element to be added to the semiconductor substrate, hydrogen gas, and diluent gas for diluting the material gas is supplied to the chamber.

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Patent Owner(s)

Patent OwnerAddress
SEN CORPORATIONTOKYO JAPAN
SUMITOMO HEAVY INDUSTRIES LTD1-1 OSAKI 2-CHOME SHINAGAWA-KU TOKYO 141-6025

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kuriyama, Masashi Yokosuka-shi, JP 2 74
Murooka, Hiroki Ehime, JP 5 117
Tanaka, Masaru Yokosuka-shi, JP 175 2217

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