MOUNTING APPARATUS AND MOUNTING METHOD
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United States of America Patent
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N/A
Issued Date -
Jan 19, 2012
app pub date -
Mar 18, 2010
filing date -
Mar 23, 2009
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Provided is a mounting apparatus which mounts a chip component on a circuit pattern on a circuit board having a plurality of circuit patterns formed thereon. The mounting apparatus is provided with a plurality of bonding tools each of which mounts the chip component on each of the circuit patterns on the circuit board. Each bonding tool is provided with, within a region on the circuit board where the chip component is to be mounted, an exclusive mounting region where only each bonding tool can mount the chip component, and a common mounting region where both the bonding tool and the adjacent bonding tool can mount the chip component. A mounting method is also provided. The mounting tact time of the chip components can be shortened even in case where a plurality of circuit patterns are formed on the circuit board and a failure circuit pattern is included among the circuit patterns which have been formed.
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