METHOD OF MANUFACTURING A LED CHIP PACKAGE STRUCTURE
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United States of America Patent
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app pub date -
Sep 21, 2011
filing date -
Apr 17, 2009
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Abandoned
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Abstract
A method of manufacturing a LED chip package structure includes the steps of: providing a substrate unit including a strip substrate body; electrically connecting a plurality of LED chips to the strip substrate body; and placing a strip package colloid body on the strip substrate body to cover the LED chips, wherein the strip package colloid body has an exposed top surface and an exposed surrounding peripheral surface connected between the exposed top surface and the strip substrate body, and the strip package colloid body has at least one exposed lens portion projected upwardly from the exposed top surface thereof and corresponding to the LED chips. Hence, light beams generated by the LED chips pass through the strip package colloid body to form a strip light-emitting area on the strip package colloid body.
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