LED module, LED package, and wiring substrate and method of making same
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United States of America Patent
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N/A
Issued Date -
Jan 5, 2012
app pub date -
Jun 22, 2011
filing date -
Jul 1, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An LED module includes an electrical insulation material including a first surface having a total reflectivity of not less than 80% with respect to light with a wavelength of 450 nm, a via hole penetrating through the electrical insulation material, a wiring pattern on a second surface of the electrical insulation material, a metal filler formed in the via hole and electrically connected to the wiring pattern, and an LED chip bonded to a surface of the metal filler on the first surface of the electrical insulation material, and sealed with a resin.
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