Micro-package for Micromachining Liquid Flow Sensor Chip
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United States of America Patent
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Issued Date -
Jan 5, 2012
app pub date -
Jul 2, 2010
filing date -
Jul 2, 2010
priority date (Note) -
Abandoned
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Abstract
The current invention disclosed a micro-package design for packaging of micromachining liquid flow sensor. The package in present invention is fabricated with micromachining or micro-molding approach, which can greatly reduce the manufacturing cost due to the batch production. The micro-package design provides packaging solution for general micromachining liquid flow sensors that can enable various microfluidic applications while reaching the cost threshold for a disposable unit.
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