POSITIVE PHOTOSENSITIVE RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Dec 29, 2011
app pub date -
Apr 18, 2011
filing date -
Jun 28, 2010
priority date (Note) -
Abandoned
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Abstract
The present invention provides a positive photosensitive resin composition, including an alkali soluble phenolic resin; an alkali soluble acrylic resin; and a photosensitive compound having quinone diazide. The positive photosensitive resin composition is applicable to a semi-additive process for forming tiny and fine wirings.
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