METAL LAYER-ATTACHED FILM FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING THE FILM, AND USE THEREOF
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United States of America Patent
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Issued Date -
Dec 29, 2011
app pub date -
Mar 23, 2010
filing date -
Mar 25, 2009
priority date (Note) -
Abandoned
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Abstract
Disclosed are a metal layer-attached film for an electronic component having an adhesive layer excellent in adhesion to a metal and excellent in the productivity, a method for producing the film, and use application of the film. The metal layer-attached film for an electronic component has a metal layer stacked on at least one surface of a resin film through an adhesive layer, wherein the adhesive layer contains an ethylene-unsaturated carboxylic acid copolymer or a metal salt thereof.
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