CURABLE COMPOSITION
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United States of America Patent
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Issued Date -
Dec 29, 2011
app pub date -
Jun 27, 2011
filing date -
Jun 29, 2010
priority date (Note) -
Abandoned
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Abstract
A conductive curable resin composition including (a) at least one vinylarene oxide, (b) at least one curing agent, and (c) at least one conductive filler; a process for making the above curable resin composition; and a cured resin composition made therefrom. The curable resin composition when cured produces a thermoset having a higher heat resistance after cure than analogous prior art compositions. The curable compositions of the present invention are advantageously useful, for example, as a die attach adhesive for semiconductor packaging material thermoset materials.
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