ACID ANHYDRIDE CURABLE THERMOSETTING RESIN COMPOSITION
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United States of America Patent
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Issued Date -
Dec 29, 2011
app pub date -
Jun 28, 2010
filing date -
Jun 28, 2010
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Abandoned
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Abstract
The present invention provides a resin composition suitable for printed circuit boards, the composition includes one epoxy resin or the mixture thereof, curing agent, promoting agents and additives, wherein the ratio of curing agent to epoxy resin is 1.55˜2.5, in which epoxy resin consists of at least one of phenol-formaldehyde multi-functional epoxy resin; curing agent comprises at least one of styrene-maleic anhydride copolymer. After hardening, this resin composition has excellent electrical properties, high glass transition temperature and excellent heat-resistant properties, applicable to the lead-free printed circuit board manufacturing process, and in the field of the high-frequency and packaging-board containing printed circuit boards.
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