HEAT-DISSIPATING BODY HAVING RADIAL FIN ASSEMBLY AND HEAT-DISSIPATING DEVICE HAVING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110315356A1
SERIAL NO

12822294

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Abstract

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A heat-dissipating device includes a heat-dissipating body, a vapor chamber and a fan assembly. The heat-dissipating body includes a thermal-conductive element and a radial fin assembly. The thermal-conductive element includes a solid post and extending arms extending therefrom. The radial fin assembly includes radially-arranged heat-dissipating fins that form a central hole to enclose the sold post, engaging troughs inserted by the extending arms, and an airflow space. An air channel is formed between any two heat-dissipating fins. The vapor chamber is provided at one end of the solid post, while the fan assembly is arranged on the other end and received in the airflow space to correspond to the respective air channels. Thus, the mobility of air and the heat-dissipating efficiency can be increased, thereby conforming to the requirements for compact design.

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Patent Owner(s)

Patent OwnerAddress
CELSIA TECHNOLOGIES TAIWAN INCNO 2 HEDING RD ZHONGLI CITY TAOYUAN COUNTY 32061

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Chieh-Ping Zhongli City, TW 38 256
Liu, Hsien-Tsang Zhongli City, TW 4 57
Meyer,, IV George Anthony San Jose, US 45 333
Sun, Chien-Hung Zhongli City, TW 73 526

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