PLASTIC CARD PACKAGE AND PLASTIC CARD PACKAGE MANUFACTURING METHOD
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United States of America Patent
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Issued Date -
Dec 22, 2011
app pub date -
Nov 19, 2010
filing date -
Jun 22, 2010
priority date (Note) -
Abandoned
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Abstract
A plastic card package and a method of manufacturing the plastic card package are provided. The plastic card package includes: a socket insertion area that is formed to expose an I/O terminal corresponding to a contact terminal of a socket electrically connected to a printed circuit board of an electronic apparatus; and a socket non-insertion area that horizontally extends from the socket insertion area and has a thickness greater than that of the socket insertion area. Accordingly, it is possible to cause the plastic card to have different thicknesses by areas so as to stably built a semiconductor chip therein and to stably mount stacked semiconductor chips thereon.
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