LASER HEATING APPARATUS FOR METAL EUTECTIC BONDING
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United States of America Patent
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app pub date -
Jun 21, 2010
filing date -
Jun 21, 2010
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Abstract
A laser heating apparatus for metal eutectic bonding is disclosed in the present invention. The laser heating apparatus has a table for supporting a substrate having a first metal; a holding unit, located above the table and moving with respect to the table, for holding an object having a second metal above the table; and a laser generator, installed below the table and moving with respect to the table, for providing a laser beam which passes through the table and the substrate to melt the first metal, to facilitate the first metal to adhered to the second metal, thereby bonding the substrate with the object. The apparatus provides good heat conduction and stability. Furthermore, the holding unit used is not only for positioning, but also exerting a pressure on the bonding metals. It makes eutectic bonding process easier and more efficient.
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