Heat Pipe And Electronic Device
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United States of America Patent
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Issued Date -
Dec 22, 2011
app pub date -
Sep 8, 2009
filing date -
Sep 5, 2008
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (3), a lower plate (4) opposing the upper plate (3), one intermediate plate or a plurality of intermediate plates (5) laminated between the upper plate (3) and the lower plate (4), a main body portion (2) formed by lamination of the upper plate (3), the lower plate (4) and the intermediate plate (5) and capable of sealing a cooling medium, a vapor diffusion path (6) capable of diffusing a vaporized cooling medium, and a capillary flow path (7) capable of reflowing a condensed cooling medium, and the vapor diffusion path (6) is formed from a first end portion (15) of the main body portion toward a second end portion (16) opposing the first end portion (15).
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