INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF
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United States of America Patent
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Issued Date -
Dec 15, 2011
app pub date -
Aug 24, 2011
filing date -
Apr 23, 2007
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An integrated circuit package system and method of manufacture thereof includes: forming an area array substrate; mounting surface conductors on the area array substrate; and molding a molded package body, having a step surrounding a core section, on the area array substrate and the surface conductors, the step providing access to the surface conductors including providing a non-vertical slope from the core section to the step.
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