INTEGRATED CIRCUIT PACKAGE SYSTEM FOR PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF

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United States of America Patent

APP PUB NO 20110306168A1
SERIAL NO

13217239

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Abstract

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An integrated circuit package system and method of manufacture thereof includes: forming an area array substrate; mounting surface conductors on the area array substrate; and molding a molded package body, having a step surrounding a core section, on the area array substrate and the surface conductors, the step providing access to the surface conductors including providing a non-vertical slope from the core section to the step.

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Patent Owner(s)

Patent OwnerAddress
STATS CHIPPAC LTDSINGAPORE SINGAPORE SINGAPORE CITY SINGAPORE

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Carson, Flynn Redwood City, US 34 1178
Chow, Seng Guan Singapore, SG 216 7432
Pendse, Rajendra D Fremont, US 164 3001
Shim, Il Kwon Singapore, SG 242 7150

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Patent Citation Ranking

  • 7 Citation Count
  • H01L Class
  • 3.01 % this patent is cited more than
  • 14 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1702407123365539219115410570614515901 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0200400600800100012001400160018002000220024002600

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