Electronic circuit substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Dec 15, 2011
app pub date -
May 18, 2011
filing date -
May 31, 2010
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
In a method of machining an electronic circuit substrate in which a sub-substrate is attached to a main substrate, an electronic circuit substrate and a method of machining the same in which the sub-substrate can be attached to the main substrate with high degree of accuracy are provided without forming the arcuate portions at corners of the outline of the substrate and corners of an insertion hole even when a router is used for machining substrates. extending from the corner of the square hole along the long side of the square hole.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully