HEAT-CONDUCTING MODULE AND HEAT-DISSIPATING DEVICE HAVING THE SAME
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United States of America Patent
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Issued Date -
Dec 8, 2011
app pub date -
Jun 7, 2010
filing date -
Jun 7, 2010
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Abandoned
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Abstract
A heat-conducting module for heat conduction of an electronic heat-generating element includes a heat pipe and a vapor chamber. The vapor chamber has an evaporating section brought into thermal contact with the electronic heat-generating element and a heat-conducting section located away from the evaporating section and wrapping around the heat pipe. With this arrangement, the contact area and heat-conducting efficiency between the vapor chamber and the heat pipe can be increased greatly, thereby obtaining a heat-conducting module with an excellent heat-conducting efficiency. With a heat-dissipating fin assembly and a fan being connected to the heat pipe, a heat-dissipating device having the aforesaid heat-conducting module can be obtained, whereby the heat of the vapor chamber and the heat pipe can be rapidly dissipated to the outside.
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