Wafer processing method, wafer polishing apparatus, and ingot slicing apparatus
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United States of America Patent
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Jun 24, 2014
Grant Date -
Dec 1, 2011
app pub date -
May 24, 2011
filing date -
May 25, 2010
priority date (Note) -
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Abstract
In a wafer processing method, an ingot is sliced into a wafer and the wafer is planarized by polishing a surface of the wafer. When the wafer is planarized, the wafer is disposed on a wafer holder and the wafer is rotated, a heat quantity is applied to a portion of the wafer so as to form a reformed layer at the portion of the wafer, and a polishing tool is brought into contact with the portion of wafer while rotating so as to polish the portion of the wafer.
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