LASER PARAMETER ADJUSTMENT
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United States of America Patent
Stats
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N/A
Issued Date -
N/A
app pub date -
Feb 12, 2010
filing date -
Feb 13, 2009
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method is provided for removing a substrate from a component with a laser. The method includes the steps of: applying a laser to a component at different locations with different power or different laser speed levels so as to remove a portion of a substrate from the component and thereby yield a number of markings on the component; measuring the different markings and generating a collection of data associated with different power or speed levels for the laser based on the markings; and adjusting at least one operating parameter of the laser based on the collection of data from the markings. Optionally, the method may be automated.
First Claim
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