THERMOPLASTIC POLYAMIDE MOULDING COMPOSITIONS
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United States of America Patent
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app pub date -
Aug 12, 2011
filing date -
May 10, 2004
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Abandoned
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Abstract
The invention relates to thermoplastic polyamide moulding compositions containing: (A) at least 20% by wt. polyamide and/or at least one copolymer containing at least 20% by wt. polyamide structural units; (B) 0.01% by wt. to 2% by wt., relative to the polyamide portion and/or the portion of polyamide structural units, of the composition of a copper-containing stabiliser; and (C) 0.01% by wt. to 3% by wt., relative to the polyamide portion and/or the portion of polyamide structural units of the composition, of at least one organic compound containing metal complexing groups, so that the copper ions are present in complexed form through binding to the metal-complexing groups. These moulding compositions may be used as coating material for coolant lines.
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