Encapsulant for Inkjet Print Head
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United States of America Patent
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Issued Date -
Nov 17, 2011
app pub date -
Jul 26, 2011
filing date -
Feb 3, 2009
priority date (Note) -
Abandoned
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Abstract
A UV curable composition suitable for use as an encapsulant to protect silicon semiconductor dies and their electrical bonding on digital print heads comprises an acrylate and/or methacrylate ((meth)acrylate) oligomer, preferably a difunctional oligomer; a diluent, preferably a (meth)acrylate; a tri-functional or tetra-functional thiol; a polypropylene oxide/butylene oxide block polymer; and a photoinitiator.
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