APPLYING WAFER BACKSIDE COATINGS TO SEMICONDUCTOR WAFERS
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United States of America Patent
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Issued Date -
Nov 17, 2011
app pub date -
May 6, 2011
filing date -
May 13, 2010
priority date (Note) -
Abandoned
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Abstract
A method for coating a silicon wafer comprises depositing a coating onto the exposed side of the wafer such that the coating is deposited on the entire surface area of the exposed side of the wafer, reaching to the edge of the wafer. This method either reduces significantly or eliminates die-fly during dicing of semiconductor wafers, and is effective for depositing thin layers, such as are needed for Al paste electrodes in solar cell fabrication.
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