RESIN COMPOSITE COPPER FOIL
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United States of America Patent
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Issued Date -
Nov 17, 2011
app pub date -
Dec 10, 2009
filing date -
Dec 26, 2008
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Abstract
This invention relates to a resin composite copper foil capable of applying a copper foil with very small unevenness on a copper foil (matte) surface without deteriorating adhesion force to a resin composition of a copper-clad laminate, and more particularly to a resin composite copper foil comprising a copper foil and a polyimide resin layer wherein the polyimide resin layer contains a specific block copolymerized polyimide resin and an inorganic filler.
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