HEAT DISSIPATION STRUCTURE FOR LIQUID CRYSTAL TELEVISION
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United States of America Patent
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Issued Date -
Nov 17, 2011
app pub date -
May 11, 2010
filing date -
May 11, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A heat dissipation structure for a liquid crystal television is disclosed. The liquid crystal television includes a front plate and a rear plate. The front plate has a screen and a metal backboard. The heat dissipation structure includes a printed circuit board (PCB) mounted to the metal backboard; a television integrated circuit (IC) chip for controlling operations of the liquid crystal television being attached on the PCB; and one or more heat dissipating posts provided between the PCB and the metal backboard. The heat generated by the television IC chip is dispersed to the metal backboard via the heat dissipating post or posts.
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