Circuitry and Method for Encapsulating the Same
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United States of America Patent
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Issued Date -
Nov 17, 2011
app pub date -
Aug 7, 2008
filing date -
Aug 31, 2007
priority date (Note) -
Abandoned
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Abstract
A circuitry comprises a substrate with a terminal region, a semiconductor device with a contact terminal, a bond wire connecting the terminal region to the contact terminal and a solder glass encapsulating material. The solder glass encapsulating material is mounted on the semiconductor device with the bond wire, so that at least the bond wire is hermetically enclosed. The substrate has a substrate material with a first coefficient of thermal expansion, the semiconductor device has a device material with a second coefficient of thermal expansion and the bond wire has a bond wire material with a third coefficient of thermal expansion. The solder glass encapsulating material has a coefficient of thermal expansion adjusted to a predefined value with regard to the second and third coefficients of thermal expansion.
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