CMP PAD DRESSERS WITH HYBRIDIZED CONDITIONING AND RELATED METHODS
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United States of America Patent
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Issued Date -
Nov 10, 2011
app pub date -
Feb 24, 2011
filing date -
May 10, 2010
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Abandoned
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Abstract
The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, for example, a CMP pad conditioner is provided. Such a conditioner can include a support matrix, and a plurality of smooth superabrasive particles disposed in the support matrix, where the smooth superabrasive particles are operable to cut large asperities in a CMP pad. The conditioner also includes a plurality of rough superabrasive particles disposed in the support matrix, where the rough superabrasive particles operable to cut slurry channels on the large asperities, and wherein the slurry channels are cut in such a way as to facilitate slurry movement across the large asperities during a CMP polishing process.
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