LEAD-FREE SOLDER ALLOY, FATIGUE RESISTANT SOLDERING MATERIALS CONTAINING THE SOLDER ALLOY, AND JOINED PRODUCTS USING THE SOLDERING MATERIALS
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United States of America Patent
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app pub date -
Jan 18, 2010
filing date -
Jan 27, 2009
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[PROBLEMS TO BE SOLVED] To provide a low-silver lead-free solder alloy having an excellent wettability and being excellent in heat-fatigue resistance, and a solder-paste soldering material and resin-flux cored soldering material being excellent in fatigue resistance, and a joined product by using the soldering material.[MEANS FOR SOLVING] 0.1 to 1.5% by weight of Cu, 0.01% by weight or more and less than 0.05% by weight of Co, 0.05 to 0.25% by weight of Ag, 0.001 to 0.008% by weight of Ge, and the remainder being Sn. This low silver lead-free solder alloy is blended with a pasty flux or molded in a liner form by using a solid or pasty flux as a core.
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