MEMS MICROPHONE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110274298A1
SERIAL NO

12978585

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A MEMS microphone includes a silicon substrate defining an opening, a diaphragm being supported above the substrate and a backplate opposite from the diaphragm for forming a capacitor together with the diaphragm. The diaphragm includes a central vibrating portion and a plurality of serpentine segments extending from an edge of the vibrating portion. Each of the serpentine segments includes a first spring and a second spring symmetric to the first spring about an axis extending from a center of the vibrating portion. Each spring includes a first end connecting to the edge of the vibrating portion, a bending portion and a second end extending from the bending portion for anchoring the diaphragm to the substrate. The bending portion extends along a path having the same outline as that of the vibrating portion.

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Patent Owner(s)

Patent OwnerAddress
AAC ACOUSTIC TECHNOLOGIES (SHENZHEN) CO LTDA-BLOCK NANJING UNIVERSITY RESEARCH CENTER SHENZHEN BRANCH NO 6 YUEXING 3RD ROAD SOUTH HI-TECH INDUSTRIAL PARK NANSHAN DISTRICT SHENZHEN P R CHINA SHENZHEN
AMERICAN AUDIO COMPONENTS INC1920 WRIGHT AVENUE LA VERNE CA 91750

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
YANG, Bin Shenzhen, CN 608 3858

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