METHOD AND DEVICE FOR INTRODUCING SOLDER ONTO A WORKPIECE
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United States of America Patent
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May 5, 2011
filing date -
May 5, 2010
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Abstract
A method and a device for introducing solder onto a solar cell is provided. The method and device employ a solder wire introduced in the molten state onto the solar cell under the action of ultrasonic vibrations applied by a sonotrode. Solder is introduced very precisely onto the solar cell, without subjecting the solar cell to undesirably high temperatures, by introducing the solder wire into a gap running between a heating device and the sonotrode, which applies ultrasonic vibrations and melts and flows through the gap onto the solar cell.
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