Boric acid replenishment in electroplating baths
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United States of America Patent
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Issued Date -
Nov 10, 2011
app pub date -
Apr 2, 2011
filing date -
May 10, 2010
priority date (Note) -
Abandoned
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Abstract
Boric acid is replenished in an electroplating bath via a replenishment solution comprising boric acid dissolved in pure water, in which the solubility at room temperature is comparable to that in the plating bath at operating temperature. The replenishment solution may be used to replace all or part of the water lost by evaporation. An automated device may be used to replenish boric acid in the electroplating bath.
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