PASTE COMPOSITION AND SOLAR CELL ELEMENT USING THE SAME

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United States of America Patent

APP PUB NO 20110272019A1
SERIAL NO

13143021

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Provided are a paste composition capable of avoiding deteriorations in a mechanical strength and an adhesion property of an electrode layer, of sufficiently attaining a desired BSF effect, and of suppressing deformation (bow) of the silicon semiconductor substrate even in a case where a silicon semiconductor substrate is rendered thin; and a solar cell element including an impurity layer, or an impurity layer and an electrode layer, which is (or are) formed by using the above-mentioned composition. The paste composition is used for forming a p+ layer (7) or an aluminum electrode layer (5) on a silicon semiconductor substrate (1) and includes an aluminum-coated compound powder. Aluminum-coated compound particles constitute this aluminum-coated compound powder, and each of the aluminum-coated compound particles includes: a compound-particle of at least of one kind of a compound selected from the group consisting of an inorganic compound and an organic compound; and an aluminum-containing coating layer which covers a surface of the compound-particle, is located in an outermost surface of each of the aluminum-coated compound particles, and contains aluminum.

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Patent Owner(s)

Patent OwnerAddress
TOYO ALUMINUM KABUSHIKI KAISHA6-8 3-CHOME KYUTARO-MACHI CHUO-KU OSAKA-SHI (OSAKA-KU

International Classification(s)

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  • 2010 Application Filing Year
  • H01L Class
  • 16510 Applications Filed
  • 13147 Patents Issued To-Date
  • 79.64 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances20102011201220132014201520162017201820192020202120220255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishibashi, Naoaki Osaka, JP 3 5
Kikuchi, Ken Osaka, JP 171 2070
Ochi, Yutaka Osaka, JP 18 183
Watsuji, Takashi Osaka, JP 16 132

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Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges1702407123365539219115410570614515901 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0200400600800100012001400160018002000220024002600

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