COOLING METHOD AND COOLING SYSTEM FOR ELECTRONIC DEVICE

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20110271695A1
SERIAL NO

13099415

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A cooling method for an electronic device, comprising: naturally circulating a refrigerant between: an evaporator which vaporizes the refrigerant by heat exchange with exhaust hot air from the electronic device, and cools the exhaust hot air; and one of a cooling tower and a condenser which is placed at a position higher than the evaporator, and liquefies the vaporized refrigerant; and valve-controlling a flow rate of a refrigerant liquid to be supplied to the evaporator so that an air temperature after heat has been exchanged for cooling by the evaporator becomes a temperature suited to an operating environment of the electronic device, wherein one of a condensation temperature and a condensation pressure of a refrigerant gas in one of the cooling tower and the condenser do not fluctuate even when the flow rate of the refrigerant liquid to be supplied to the evaporator is valve-controlled.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
HITACHI PLANT TECHNOLOGIES LTDTOKYO JAPAN TOKYO METROPOLIS

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inadomi, Yasuhiko Saitama-shi, JP 10 90
Ito, Junichi Nagareyama-shi, JP 211 3416
KASHIRAJIMA, Yasuhiro Tokyo, JP 17 305
Oshima, Noboru Iruma-shi, JP 51 848
Senda, Masakatsu Kounosu-shi, JP 12 129
Shimokawa, Ryoji Tokyo, JP 5 72
Sugiura, Takumi Kashiwa-shi, JP 35 435

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation