SUBSTRATE
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United States of America Patent
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N/A
Issued Date -
Nov 3, 2011
app pub date -
Jan 7, 2011
filing date -
Jan 14, 2010
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
It is an object of the invention to provide a substrate which allows visual confirmation of the joint state and improvement of reliability of the joint between the components and the substrate to be mounted. The substrate is configured to mount a component having a planer terminal and include a land subjected to solder joint with respect to the terminal of the component.A substrate includes notched portions formed by notching parts of the lands in the direction away from an end surface forming the space. The each land on the substrate includes a first land formed on the substrate and a second land formed of an end surface of the notched portion in the direction of thickness of the substrate. Therefore, visibility of parts of terminals of components is secured utilizing penetration of the notched portions at the time of soldering, so that the joint state of soldering can be visually confirmed.
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